Ericsson makes plans, but RIM won’t give up

July 26, 2009 | Telefon AB LM Ericsson’s successful bid for Nortel’s wireless assets gives it a new advantage in the North American mobile marketplace, locking out a key competitor as carriers begin the transition to more data-intensive technology.

Ericsson to acquire majority of Nortel’s North American wireless business

July 25, 2009 : Ericsson (NASDAQ:ERIC) has today entered into an asset purchase agreement to acquire the parts of the Carrier Networks division of Nortel relating to CDMA and LTE technology in North America. The purchase is structured as an asset sale at a cash purchase price of USD 1.13 b. on a cash and… Continue reading Ericsson to acquire majority of Nortel’s North American wireless business

Wireless goalposts move, with 802.16m steps and LTE core trials

July 24, 2009 | CAROLINE GABRIEL : The next generation wireless game is one of constantly moving goalposts and even as one platform is trialled, the next is already in the works. This week sees a milestone for the next iteration of the standard underpinning WiMAX, 802.16m, and the first operator trial plans for interoperability… Continue reading Wireless goalposts move, with 802.16m steps and LTE core trials

MIMO Transmission Schemes for LTE and HSPA Networks

July 23, 2009 | LteWorld -3G Americas has recently published an report: MIMO Transmission Schemes for LTE and HSPA Networks. The report is intended increases awareness and helps guide the deployment of MIMO technology in HSPA and LTE networks.

Ericsson Submits Bid in Nortel Mobile Assets Auction

July 23 (Bloomberg) — Diana ben-Aaron | Ericsson AB, the world’s largest maker of wireless phone networks, submitted a bid for Nortel Networks Corp.’s wireless assets, which may help bolster sales of services in North America.

Qualcomm LTE Slip Could Mean Data Card Delays

JULY 22, 2009 | Dan Jones | Qualcomm Inc. will be months later than expected in shipping its first Long Term Evolution (LTE) silicon samples for data cards, which could push back products based on the chipsets to later in 2010.