Sequans Communications has announced a technology and marketing collaboration with Fujitsu Semiconductor Limited for the purpose of providing customers with a comprehen
Sequans Communications has announced a technology and marketing collaboration with Fujitsu Semiconductor Limited for the purpose of providing customers with a comprehensive, high-performance LTE product offering that combines Fujitsu Semiconductor’s multimode 2G/3G/LTE RF solution with Sequans’ LTE baseband solutions.
The Fujitsu Semiconductor RF transceiver supports all major global bands and modes, including LTE bands, and will be pre-integrated and fully validated with Sequans’ LTE chips by Sequans, the company said.
The Sequans/Fujitsu Semiconductor combined solution features Fujitsu Semiconductor’s MB86L12A 2G/3G/LTE RF CMOS transceiver and Sequans’ SQN3110 and SQN3120 baseband chips. The MB86L12A supports all 3GPP LTE-FDD and LTE-TDD bands. The SQN3110 is Sequans’ new generation 40 nm LTE baseband chip that is 3GPP R9 compliant, supporting category 4 throughput and providing extremely low power consumption in a very small footprint for handsets and the smallest of mobile devices. The SQN3120 adds an integrated applications processor for portable hotspots, hostless USB modems, and CPE devices.
The technical collaboration will focus on ensuring that the combined platform solution is optimized and is fully verified, and that customers can quickly move through the design and prototyping stage into production. Each company will maintain separate responsibility for price, availability and support of its respective products included in the combined platform.
Reference designs for multiple device types based on the combined Sequans/Fujitsu Semiconductor LTE solution are expected to be available from Sequans beginning later this year.